graph LR
subgraph "高压脉冲发射通道"
A["高压电源 \n ±60V~±100V"] --> B["储能电容阵列"]
B --> C["脉冲成形网络"]
C --> D["VBI125N5K \n 发射开关"]
D --> E["脉冲变压器初级"]
E --> F["RC缓冲网络 \n 尖峰抑制"]
F --> G["初级地"]
H["脉冲控制器"] --> I["隔离驱动器"]
I --> J["栅极驱动电阻"]
J --> D
end
subgraph "探头接口与保护"
E --> K["脉冲变压器次级"]
K --> L["探头匹配网络"]
L --> M["超声探头阵元"]
N["接收保护电路"] --> M
N --> O["限幅二极管"]
O --> P["接收放大器输入"]
end
subgraph "噪声隔离设计"
Q["发射地平面"] -.->|物理隔离| R["接收地平面"]
S["屏蔽层"] --> T["机壳地"]
U["滤波电容"] --> V["去耦网络"]
end
style D fill:#e8f5e8,stroke:#4caf50,stroke-width:2px
style M fill:#e1f5fe,stroke:#03a9f4,stroke-width:2px
数字核心DC-DC供电拓扑详图
graph TB
subgraph "同步Buck转换器主拓扑"
A["输入12V"] --> B["输入电容组"]
B --> C["上管MOSFET"]
C --> D["开关节点"]
D --> E["VBQG1410 \n 同步整流下管"]
E --> F["功率地"]
D --> G["输出滤波电感"]
G --> H["输出电容组"]
H --> I["VDD_CORE \n 1.2V@15A"]
end
subgraph "控制与驱动电路"
J["Buck控制器"] --> K["上管驱动器"]
J --> L["同步整流驱动器"]
K --> C
L --> E
M["电压反馈"] --> N["误差放大器"]
N --> J
O["电流检测"] --> P["电流比较器"]
P --> J
end
subgraph "纹波抑制与布局"
Q["多层陶瓷电容"] -->|高频去耦| I
R["PCB功率层"] -->|低阻抗路径| E
S["过孔阵列"] -->|热传导| T["内部地层"]
U["开尔文连接"] -->|精确检测| O
end
subgraph "负载动态响应"
I --> V["CPU核心电源"]
I --> W["FPGA核心电源"]
I --> X["AI加速器电源"]
Y["负载瞬态"] --> Z["动态电压调节"]
Z --> J
end
style E fill:#e3f2fd,stroke:#2196f3,stroke-width:2px
style I fill:#fce4ec,stroke:#e91e63,stroke-width:2px
智能外围电源管理拓扑详图
graph LR
subgraph "双P-MOS负载开关通道"
subgraph "VBTA4250N-1 双通道"
A1["MCU_GPIO1"] --> B1["电平转换"]
B1 --> C1["VBTA4250N-1_IN1"]
D1["12V电源"] --> E1["VBTA4250N-1_D1"]
E1 --> F1["通道1输出"]
C1 --> G1["内部P-MOS1"]
G1 --> F1
F1 --> H1["温度传感器"]
end
subgraph "VBTA4250N-2 双通道"
A2["MCU_GPIO2"] --> B2["电平转换"]
B2 --> C2["VBTA4250N-2_IN1"]
D2["12V电源"] --> E2["VBTA4250N-2_D1"]
E2 --> F2["通道2输出"]
C2 --> G2["内部P-MOS2"]
G2 --> F2
F2 --> H2["Wi-Fi模块"]
end
end
subgraph "软启动与保护"
I["PWM控制"] --> J["缓启动电路"]
J --> K["VBTA4250N栅极"]
L["过流检测"] --> M["保护逻辑"]
M --> N["快速关断"]
O["续流二极管"] --> P["感性负载"]
P --> Q["继电器/风扇"]
end
subgraph "电源时序管理"
R["电源管理IC"] --> S["上电序列控制"]
S --> T["传感器先上电"]
S --> U["通信模块后上电"]
V["待机模式"] --> W["外围断电"]
W --> X["仅MCU运行"]
end
style C1 fill:#fff3e0,stroke:#ff9800,stroke-width:2px
style C2 fill:#fff3e0,stroke:#ff9800,stroke-width:2px
热管理与噪声控制拓扑详图
graph TB
subgraph "三级热管理架构"
A["一级重点散热"] --> B["VBQG1410同步管"]
A --> C["大面积敷铜"]
C --> D["过孔阵列散热"]
D --> E["内部地层"]
E --> F["金属外壳"]
G["二级局部散热"] --> H["VBI125N5K高压管"]
G --> I["顶部敷铜"]
I --> J["局部散热片"]
K["三级自然冷却"] --> L["VBTA4250N开关"]
K --> M["控制IC"]
M --> N["环境对流"]
end
subgraph "噪声隔离与控制"
O["发射电路区"] --> P["独立地平面"]
Q["接收电路区"] --> R["模拟地平面"]
S["数字电路区"] --> T["数字地平面"]
P -->|单点连接| U["系统星形地"]
R --> U
T --> U
V["屏蔽罩"] --> W["敏感电路"]
X["滤波电容"] --> Y["电源去耦"]
Z["铁氧体磁珠"] --> AA["高频抑制"]
end
subgraph "EMI控制措施"
AB["输入滤波器"] --> AC["共模扼流圈"]
AD["输出滤波器"] --> AE["π型滤波"]
AF["布局优化"] --> AG["最小回路面积"]
AH["层叠设计"] --> AI["完整参考平面"]
end
style B fill:#e3f2fd,stroke:#2196f3,stroke-width:2px
style H fill:#e8f5e8,stroke:#4caf50,stroke-width:2px
style L fill:#fff3e0,stroke:#ff9800,stroke-width:2px