graph LR
subgraph "电磁刹车驱动电路"
A[直流母线] --> B["VBQF2120 \n P-MOSFET"]
B --> C[电磁刹车线圈]
C --> D[主地]
E[MCU PWM] --> F[驱动电路]
F --> B
subgraph "电流检测与保护"
G[电流检测电阻] --> H[运放放大器]
H --> I[ADC输入]
I --> E
end
end
subgraph "保护网络"
J["Rg栅极电阻"] --> B
K["ESD保护二极管"] --> B
L["RC吸收网络"] --> B
M["续流二极管"] --> C
end
subgraph "热管理设计"
N["PCB大面积铜箔"] --> B
O["过孔阵列"] --> B
P["小型散热片"] --> B
Q["温度传感器"] --> E
end
style B fill:#e8f5e8,stroke:#4caf50,stroke-width:2px
style M fill:#ffebee,stroke:#f44336,stroke-width:2px
辅助电源同步整流拓扑详图
graph TB
subgraph "同步Buck转换器"
A[直流母线] --> B[主开关管]
B --> C[电感]
C --> D[输出电容]
D --> E[5V输出]
subgraph "同步整流管"
F["VBC6N2022 \n 双N-MOSFET \n (共漏极)"]
end
C --> F
F --> G[电源地]
H[Buck控制器] --> I[上管驱动器]
H --> J[下管驱动器]
I --> B
J --> F
subgraph "开关时序控制"
K[互补PWM] --> H
L[死区时间] --> H
end
subgraph "反馈环路"
E --> M[电压反馈]
C --> N[电流反馈]
M --> H
N --> H
end
end
subgraph "PCB布局优化"
O[最小开关回路] --> B
O --> F
P[电源层分割] --> B
P --> F
Q[地平面完整性] --> G
end
style F fill:#e3f2fd,stroke:#2196f3,stroke-width:2px
style B fill:#f3e5f5,stroke:#9c27b0,stroke-width:2px
智能负载管理拓扑详图
graph LR
subgraph "风扇智能控制通道"
A[MCU GPIO] --> B[电平转换]
B --> C["VB1210 \n N-MOSFET"]
D[5V电源] --> C
C --> E[散热风扇]
E --> F[地]
G[温度传感器] --> A
subgraph "PWM调速控制"
H[PWM发生器] --> A
I[温度映射] --> H
end
end
subgraph "指示灯组控制通道"
J[MCU GPIO] --> K["VB1210 \n N-MOSFET"]
L[5V电源] --> K
K --> M[LED阵列]
M --> N[限流电阻]
N --> F
subgraph "编组控制逻辑"
O[亮度控制] --> J
P[模式选择] --> J
end
end
subgraph "传感器电源管理"
Q[MCU GPIO] --> R["VB1210 \n N-MOSFET"]
S[5V电源] --> R
R --> T[传感器阵列]
T --> U[信号调理]
U --> A
subgraph "节能管理"
V[睡眠模式] --> Q
W[唤醒检测] --> Q
end
end
subgraph "PCB布局优势"
X[超小封装] --> C
X --> K
X --> R
Y[高密度布局] --> C
Y --> K
Y --> R
Z[简化布线] --> C
Z --> K
Z --> R
end
style C fill:#fff3e0,stroke:#ff9800,stroke-width:2px
style K fill:#fff3e0,stroke:#ff9800,stroke-width:2px
style R fill:#fff3e0,stroke:#ff9800,stroke-width:2px
热管理与可靠性拓扑详图
graph TB
subgraph "三级热管理策略"
subgraph "一级热源: 电磁刹车驱动"
A["VBQF2120 \n (主要发热源)"] --> B["PCB边缘布局"]
B --> C["底层大面积铜箔"]
C --> D["过孔阵列散热"]
D --> E["可选散热片"]
end
subgraph "二级热源: 辅助电源"
F["VBC6N2022 \n (中等发热)"] --> G["TSSOP8封装散热"]
G --> H["PCB正面敷铜"]
H --> I["开关回路最小化"]
end
subgraph "三级热源: 负载开关"
J["VB1210 \n (低发热)"] --> K["标准PCB布局"]
K --> L["自然对流冷却"]
end
end
subgraph "温度监控与闭环控制"
M["温度传感器1 \n (VBQF2120附近)"] --> N[MCU]
O["温度传感器2 \n (PCB热点)"] --> N
P["温度传感器3 \n (环境)"] --> N
N --> Q[热管理算法]
Q --> R[风扇PWM控制]
R --> S[动态调速]
Q --> T[功率降额]
T --> U[保护触发]
end
subgraph "可靠性加固设计"
subgraph "电气保护"
V["栅极保护 \n (Rg+ESD)"] --> A
V --> F
V --> J
W["电压尖峰抑制 \n (续流+吸收)"] --> A
X["过流保护 \n (电流检测)"] --> A
X --> F
Y["过温保护 \n (温度检测)"] --> A
Y --> F
Y --> J
end
subgraph "降额设计"
Z["电压降额80%"] --> A
AA["电流降额 \n (根据热阻)"] --> A
AA --> F
AB["瞬态热分析"] --> A
AB --> F
end
end
style A fill:#e8f5e8,stroke:#4caf50,stroke-width:2px
style F fill:#e3f2fd,stroke:#2196f3,stroke-width:2px
style J fill:#fff3e0,stroke:#ff9800,stroke-width:2px